Wafer Aligner/Bonder —— IC Back-end Manufacturing


SWA Series Wafer Aligner

SWB Series Wafer Bonder

SWDB Series Wafer Debonder

The SW series aligner/ bonder / debonder are designed for various types of applications in MEMS, power devices, CMOS image sensor, advanced packaging (3D-TSV, WLP, etc.) and compound semiconductor (LED, RF, etc.). The SWA is for bonding and alignment of different wafers. The SWB covers multiple bonding methods, including adhesive, glass-frit, eutectic and anodic. The SWDB is to meet debonding process requirements.
   Product Features

● Flexible Alignment Mode and Application

● High Precision Pressure and Excellent Temperature Control

● Warped Wafer and Ultra-thick Wafer Handling

● Low COO

● Convenient Upgrade Design

   Specifications

M

SWA200

SWA300

Wafer Size

200mm

300mm

Alignment Mode

Face to face Alignment

Face to face Alignment

Alignment Precision

<±2μm

<±2μm

 

Model

SWB200

SWB300

Wafer Size

200mm

300mm

Maximum Contact Force

5KN(100KN Optional)

30KN(100KN Optional)

Force Uniformity

<1%

<1%

Maximum Temperature

250℃ (550℃ Optional)

250℃ (550℃ Optional)

Maximum Vacuum

<5×10-5 mbar

<5×10-5 mbar

Anodic Bonding

0-2000 V/50mA (Optional)

0-2000 V/50mA (Optional)

 

Model

SWDB200/10

SWDB300/10

Wafer Size

200mm

200mm/300mm

Maximum Temperature

300℃

300℃